Best-Selling Ultrasonic Assisted Grinding - Copper Wire inlay ultrasonic wire embedding for contactless card welding – Powersonic

Introduction:

Through fully automated, high-speed ultrasonic wire embedding, throughputs can be decisively optimized even at a low substrate thickness of 100–400 μm. Both varying substrate material (such as PC and PVC) and wire thickness (80–150 μm) can be processed using up to 12 wire-embedding heads on this machine Therefore, throughputs of 4,400 antennas/hour are now a thing of the past.Radio frequency identification (RFID) inlays are manufactured throughout the world for many purposes: biometric passports, the contactless smart card market (e-ID, electronic healthcare cards, payment cards, public transportation), and for dual interface applications. At the same time, wire-embedded high frequency (HF) RFID antennas are available and offer a number of advantages over printed, etched, or galvanized variations.

Among others, the ability to freely select shapes is enticing for card and passport manufacturers, since this can lead to competitive advantages. Further benefits, such as environmental friendliness, durability, and improved product quality, also should be mentioned.

Specifications:

Compared

For ordinary ultrasonic wire embedders, as the tool head of the wire is worn, the frequency will inevitably change (the product size determines the product frequency). When the frequency changes to a certain extent, it is difficult for the generator to find the frequency of the tool head, which affects the entire The ultrasonic system works normally. At this time, only the new wire bonding tool head must be replaced.

The RPS-SONIC wire burying device has been greatly improved. The improved ultrasonic wire burying device has greatly improved product performance, more stable work, stronger automatic frequency adaptability, and more beautiful appearance. This problem is largely solved. Even if the tool head is worn to a certain degree, the generator can automatically search and find the change of the frequency of the ultrasonic vibrator, thereby ensuring the stable operation of the entire ultrasonic system, and the service life of the tool head will be extended. 2 -3 times, truly saving costs for the majority of users. It has 30% more power than traditional ultrasonic wire buried devices, and solves the problem of heat generation of ultrasonic generator and vibrator, which can work for a long time.

Applications:

Radio frequency identification (RFID) inlays are manufactured throughout the world for many purposes: biometric passports, the contactless smart card market (e-ID, electronic healthcare cards, payment cards, public transportation), and for dual interface applications. At the same time, wire-embedded high frequency (HF) RFID antennas are available and offer a number of advantages over printed, etched, or galvanized variations.

Among others, the ability to freely select shapes is enticing for card and passport manufacturers, since this can lead to competitive advantages. Further benefits, such as environmental friendliness, durability, and improved product quality, also should be mentioned.

Advantage:

The amplitude can be adjusted to ensure the RFID embedding stability;

· High frequency, reach to 70khz, welding more smoothly;

· Ultrasonic system design precision is very high, good customer feedback;

· In particular, digital power supply design, has been in a leading position in the ultrasonic industry;

· Automatically tracks frequency and has a very wide frequency range that extends the life of the ultrasonic units.

· Cabinet type, can control 3/4/5 burying heads to work at the same time

· touch screen control or external PLC control, easier operation

· 20%-100% energy continuously adjustable on the line, used in all sizes of smart card embedding applications

· wear-resistant titanium alloy tool head, suitable for 0.05-0.2 mm copper wire

· light body design, beautiful and durable, good heat dissipation

· 24-hour work, uniform energy output

· Suitable for high-speed embedding applications, embedding twice the speed of 60K devices