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Bakeng sa lisebelisoa tsa ultrasonic plating, sheba ho RPS-SONIC

328 mantsoe | E qetetse ho ntlafatsoa: 2026-01-20 | By Fiona - Powersonic
Fiona - Powersonic - author
Mongoli: Fiona - Powersonic
Mochini oa welding oa Ultrasonic, mochini o sehang oa ultrasonic, ultrasonic homogenizer/sonicator, ultrasonic sprayer
Re fana ka litharollo tse ikhethileng, tse ncha, le tse tšoarellang.
For ultrasonic plating equipment, look to RPS-SONIC
Lethathamo la Tse ka Hare
    Lisebelisoa tsa ultrasonic tinning ke karolo ea bohlokoa ea lisebelisoa tsa phekolo ea holim'a tšepe indastering ea tlhahiso. Ka ho sebelisa theknoloji ea ultrasonic, e fetotse mekhoa ea khale ea ho etsa tinning mme e fetohile ts'ehetso ea mantlha ea ts'ebetso mafapheng a kang lisebelisoa tsa elektroniki le matla a macha. Boleng ba eona bo ka sehloohong bo mabapi le ho fihlela tinning e sebetsang hantle le e hloekileng ntle le tlhokahalo ea ho feto-fetoha ha lik'hemik'hale, ho khanna indasteri ho ea phetohong e tala le e phahameng.

    Thepa e fetola matla a mains hore e be a phahameng - maqhubu a maqhubu a motlakase ka phepelo ea motlakase, e ntan'o fetoloa micron-level longitudinal vibration ke transducer ebe e holisoa ke amplitude transformer pele e fetisetsoa hloohong e sisinyehang. Ha workpiece e qoelisoa ka solder e qhibilihisitsoeng, phello ea cavitation e hlahisoang ke high-frequency vibration e hlobola lesela la oxide holim'a tšepe 'me ka nako e le 'ngoe e sutumelletsa solder e qhibilihisitsoeng hore e kene ka har'a micropores ea thepa. Lera le letenya, bubble - lera le sa lefelloeng la ho roala le ka etsoa ka metsotsoana e 2 - 3 feela, ntle le tlhoko ea kalafo ea pele kapa lits'ebetso tse latelang tsa ho hloekisa.

    Melemo ea Bohlokoa

    1.Tikoloho e hloekile ebile e hloekile: E felisa phallo e tloaelehileng, e felisa ho ntšoa ha khase e kotsi le metsi a litšila le ho fokotsa kotsi ea ho bola likarolong tse rekisoang.

    2.E sebetsa hantle haholo ebile e tlase - Litšenyehelo: E eketsa katleho ea tlhahiso ka ho feta 50%, e fokotsa tšebeliso ea solder ka 30%, 'me e tšehetsa aluminium - bakeng sa-theknoloji ea koporo, ho boloka 80% ka litšenyehelo tsa terata.

    3.E sebetsa ka ho Fetisisa: Na lisebelisoa tsa solder tseo ho leng thata ho li sebetsa ka mekhoa ea setso, joalo ka likhalase, li-ceramics, le li-semiconductors; e tsamaellanang le ho kopanya lisebelisoa tse fapaneng.

    4.E tsitsitse ebile e ka tšeptjoa: Ho khomarela ka matla ho plating le ts'ebetso e babatsehang ea ho tiisa, ho finyella litlhoko tsa tšebeliso libakeng tse feteletseng.

    Thepa ena e 'nile ea sebelisoa haholo ha ho etsoa likarolo tsa elektroniki, li-electrode tse ncha tsa betri ea koloi ea matla, liphanele tsa letsatsi le lisebelisoa tsa sefofane. E fetohile karolo ea bohlokoa ea lisebelisoa bakeng sa ho ntlafatsa ts'epahalo ea sehlahisoa, haholo-holo lits'ebetsong tse phahameng - tse nepahetseng tse kang aluminium wire welding bakeng sa li-motors, tlhahiso ea sensor, le khokahanyo ea electrode ea khalase ea photovoltaic. Ka tsoelo-pele ea phetoho e tala tlhahisong, boholo ba mmaraka oa lefats'e bo fihlile ho $ 528 milione ka 2024 mme ho lebelletsoe hore e tla tsoela pele kholo ea eona e tsitsitseng.

    Tlohela Molaetsa wa Hao