I-Ultrasonic Soldering i-advanced welding technology esebenzisa ukuphakama - imvamisa yokudlidliza imishini yokudlidliza ukufeza ukuxhumana kwensimbi. Kuthuthukisa kakhulu ukulinganiselwa kwezindlela zendabuko ezisetshenziswayo ezintweni ezikhethekile ze-Welding ngokwazisa amandla e-ultrasonic enqubweni yokuthengisa. Lobu buchwepheshe bavela maphakathi nekhulu le-20 lekhulu lama-20 futhi ekuqaleni kwasungulwa ukuxazulula inkinga yobunzima e-aluminium ye-welding kanye nama-alloys ayo. Manje sekuthuthukiswe kwinqubo ebaluleke kakhulu emikhakheni yokupakishwa kwe-microelectronic kanye nokubhala izinto zokubhala.
Uma kuqhathaniswa nobuchwepheshe bendabuko ye-Soldering Technology, i-Ultrasonic Soldering inezinzuzo eziningana ezibalulekile: Okokuqala, kungafinyelela ukufudumala emazingeni okushisa aphansi, kunciphisa ubungozi bomonakalo wokushisa - izingxenye ezibucayi; Okwesibili, ukudlidliza kwe-ultrasonic kungabhubhisa ngempumelelo ungqimba lwe-oxide endaweni yensimbi ngaphandle kwesidingo se-flux esolisayo; Okwesithathu, lobu buchwepheshe bunezidingo eziphansi kakhulu zemvelo ye-welding, futhi imiphumela emihle yokushisela ingatholakala ngaphandle kwegesi evikelayo. Lezi zici zenza ukuthengisa kwe-ultrasonic ikakhulukazi zilungele kakhulu izidingo zokwakha umkhiqizo omncane kakhulu futhi ozindilinga embonini yanamuhla ye-elekthronikhi.
Mayelana nezinhlelo zokusebenza zezimboni, imishini yokuthengisa ye-ultrasonic isetshenziswe kabanzi ekuphakameni - izinkambu ezinengqondo ezinjengokupakishwa kwe-chip ye-LED, ukukhiqizwa kwephaneli yelanga, umhlangano we-microelectronic, kanye nokukhiqizwa kwensiza yezokwelapha, kanye nokukhiqizwa kwensiza yezokwelapha. Ngokuthuthuka okusheshayo kwezimboni ezivelayo ezifana nemishini yokuxhumana ye-5G nezinhlelo zokulawulwa kwebhethri kagesi, isidingo sobuchwepheshe be-Ultrasonic Soldering Technology sekhombise inkambiso yokukhula eqhubekayo.
2. Ukusebenza komgomo wemishini yokuthengisa ye-ultrasonic
Isimiso esiyisisekelo sohlelo lwe-Ultrasonic Soldering System ukusebenzisa umphumela we-piezoelectric ukuguqula amandla kagesi aphezulu - Imvamisa i-mechanical vibration. Lapho ukuphakama - imvamisa kagesi esebenza nge-piezoelectric transducer, i-transducer izokhiqiza ukudlidliza imvamisa ye-ultrasonic kuya ku-60khz kuya ku-60khz, okukhuliswe ngophondo (amplitude Converter) futhi kudluliselwe ekhanda le-welding ithuluzi.
Ngesikhathi senqubo ye-welding, ukudlidliza kwe-ultrasonic kukhiqiza imiphumela ehlukahlukene yomzimba esibonakalayo sokuxhumana phakathi kwe-soler ne-substrate: Ngakolunye uhlangothi, amandla okufika, okuphezulu kwe-suars aqeda ngqo i-cap yensimbi endaweni yensimbi, eveza insimbi emsulwa; Ngakolunye uhlangothi, umphumela wokushisa wokushisa ukhiqiza izinga lokushisa elanele ukuze kuncibilike i-soler, kanye nomphumela we-cavitation okubangelwa ukudlidliza kukhuthaza ukuhamba nokungezelelwa komthengisi owuketshezi. Lo mshini wesenzo esiyinhlanganisela ungafinyelela ubuhlobo obuthembekile be-metallurgical emazingeni okushisa aphansi kakhulu kune-solder yendabuko (imvamisa 30 - 50 ° C ephansi kunendawo yokuncibilika ye-solder).
Ukukhethwa imvamisa ye-Expart kuyinto ebalulekile yedizayini yohlelo, futhi imvamisa yokusebenza ejwayelekile kufaka i-20KHZ, 35KHZ no-60khz. Amanani aphansi anikezela nge-amplitude enkulu kanye nokukhishwa kwamandla, alungele izinto ezinzima ze-welding; Izakamisa eziphakeme zingafinyelela ukulawulwa okuhle, ezilungele ukuqondiswa kwengxenye yezakhi ezincane. Izinhlelo zanamuhla ze-Ultrasonic Soldering zivame ukufakwa kubuchwepheshe bokulandela i-othomathikhi yokulandela i-othomathikhi, ezingashintsha ngesikhathi sangempela ukugcina isimo se-resonant futhi siqinisekise ukusebenza kahle kwamandla okudluliswa kwamandla.
3. Izinkambu zohlelo lokusebenza kanye namacala ajwayelekile
Imishini yokuthengisa ye-Ultrasonic idlala indima ebalulekile kuma-High Phesti - Izinkambu zezobuchwepheshe. Embonini ye-Microelectorics Packaging Emboni, lobu buchwepheshe busetshenziselwa kakhulu ukuxhumeka phakathi kwama-chips kanye nezindawo ezingezansi, ikakhulukazi ezinkulu - I-Area Welding yamadivayisi wamandla (afana namamojula we-IGBT). Umkhiqizi we-elekthronikhi olwaziwa kahle asebenzisa uhlelo olunhlobonhlobo - Inhloko ye-Ultrasonic Soldering System ukufezekisa ukukhiqizwa kwesisindo samamojula wamandla, futhi isilinganiso sokulungiswa okuhlangene sokwengeza sisuka ku-92% sendlela yendabuko siye ku-99.8%, ngenkathi kunciphisa ukushisa -
Ukukhiqiza okuholwa yinkambu yesicelo esejwayelekile. I-Ultrasonic Soldering isetshenziselwa ukuxhuma ama-chip we-LED kubakaki, ukugwema inkinga yokumelana ne-thermal okubangelwa yi-glue yesiliva yendabuko. Ngemuva kokuthi umenzi omkhulu we-LED wethula umugqa wokukhiqiza ozenzakalelayo we-ultrasonic worderic woldering, ukumelana okushisayo komkhiqizo kwancishiswa ngama-35%, ukuguquguquka okukhanyayo kwandiswa ngo-8%, kanye nezingozi zokuthembela ezibangelwa yizinsalela ze-flux ziqediwe ngokuphelele.
Emkhakheni wamandla amasha, ukuthengisa i-ultrasonic kuxazulula inkinga ye-busbar welding yamaphaneli elanga. Uma kuqhathaniswa ne-welding yomoya eshisayo yendabuko, inqubo ye-ultrasonic inciphisa izinga lokuphuka kwamaseli webhethri kusuka ku-5% kuya ngaphansi kuka-0.2%, ngenkathi ukhula isivinini se-welding ngamahlandla ama-3. I-Photovoltaic Enterprise isebenzisa uhlelo lwe-welding lwe-ultrasonic olunokuma okubonakalayo okuhlangene ukufezekisa okuphezulu okuzenzakalelayo - ukunemba kwe-welding kwamaseli welanga ayi-156mm, ngesilinganiso esijwayelekile sokukhiqizwa kwansuku zonke kwezingcezu ezingama-8,000.
Ekwenziweni kwemishini yokuqashelwa kwe-5G, ubuchwepheshe be-weltrasonic boldering busebenza kahle ekuphaketheni okuphezulu - amava okuhlunga imvamisa, ama-antenna ahlukene nezinye izinto. Umkhiqizi we-Base Station Manzi usebenzisa i-60khz High - Uhlelo lwe-Frequency Ultrasonic ukuzuza ngempumelelo uxhumano oluthembekile lokuhlangana okungu-0.2mm kokuhambisa imali engaphansi kwe-0.1DB, okuhambisana ngokuphelele nokuhanjiswa kwesiginali.