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20Khz Autoresonant Ultrasonic Treatment Ultrasonic Material Processing

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20Khz Autoresonant Ultrasonic Treatment Ultrasonic

Material ProcessingDescription

Frequency:20khzPower:1000W
Amplitude:15~50umGap Overcut:0.02-0.1
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ultrasonic assisted drilling

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ultrasonic milling components

Parameter

ItemParameter
AbrasiveBoron carbide, aluminium oxide and silicon carbide
Grit size(d0)100 – 800
Frequency of vibration (f)19 – 25 kHz
Amplitude of vibration (a)15 – 50 µm
Tool materialSoft steel titanium alloy
Wear ratioTungsten 1.5:1 and glass 100:1
Gap overcut0.02-0.1 mm

Introduction:

Technologies that use ultrasonic vibration to intensify processes are gaining wide recognition in scientific and industrial environments. By superimposing high frequency vibration, the basic mechanical behaviour of many processes and materials is seen to be transformed. This leads to the development of new achines and processes with advanced characteristics. Important results of processing some materials with autoresonance ultrasonic nano-turning . After ultrasonic processing of materials,nanostructured near-surface layers emerge. These structures are responsible for the micromechanical characteristics of the material. The developed technology allows processing of various hard-to-machine materials with the obtainment of a surface of heightened geometrical and mechanical properties and with minimum power inputs and material capacity. The article presents the results of the analysis of the structure of component surface layers subjected to ultrasonic turning with an auto-resonant device. The presented photographs demonstrate the formation of nanostructures in the thin surface layers of the processed sample materials. It is shown that autoresonant ultrasonic treatment leads to hardening of the surface layers. At present, there are some new devices for vibro-cutting and smoothing of materials, such as titan and titanic alloys, heat resisting steels, ceramics, and various kinds of glass, pig-iron, and others. Moreover, owing to the well-directed processing of the near-surface layers of materials, where systems of nanostructures are formed, a number of intermediate operations, such as, for instance, grinding and polishing, turn out to be excluded from the technological processes, and this, as a consequence, enables one to lower the manufacture cost price.

 

Application:

1. Processing of difficult-to-cut materials: stainless steel, hardened steel, high-speed steel, titanium alloy, high-temperature alloy, cold-hardened cast iron, and non-metal materials such as ceramics, glass, stone, etc., which are difficult to process due to mechanical, physical, and chemical characteristics, such as Using ultrasonic vibration cutting can make it easier.2. Cutting of difficult-to-machine parts: such as slender shaft parts that are easy to bend and deform, small-diameter deep holes, thin-wall parts, thin-disk parts and small-diameter precision threads, as well as complex shapes, high machining accuracy and surface quality requirements Components.3. High precision, high surface quality workpiece cutting.4. Difficult chip removal and chip breaking.Fourth, the application of ultrasonic vibration chip: widely used in aviation, aerospace, military and other fields.

20Khz Ultrasonic Machining Tool Ultrasonic Vibration Assisted Ceramic Glass Cutting 0


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  • Q1.What kind material of the horn?

    A. Titanium alloy, we also customized aluminum hom for customer before.

    Q2.What’s the time of delivery?

    A. For Conventional hom, 3 days, for customized hom 7 work days.

    Q3.Does ultrasonic extraction also require the addition of a chemical catalyst?

    A. No . but some time need Mechanical stiring.

    Q4.Can the device work continously?

    A. Yes ,it can work 24hours continously.

    Q5.What’s the Processing capacity of one set ultrasonic extraction equipment?

    A. Different hor different Processing capacity, for 2000W Nine section whip horm can dealing 2L~10Lmin.

    Q6.What’s the warranty of your sonicator equipment?

    A. All equipment one year warranty.

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