Sefuba sa ultrasoc le ho tsikitlanya

20Kh ultrasoc ultrasoc

Tlhaloso e khutšoane:

Pitsa ea sehlōhō ea ultrasoc ke sesebelisoa se ikhethang se sebelisang boemo bo phahameng ho feta ho thusa ho weld. E sebelisoa haholo bakeng sa ho nepahala ha mekhahlelo ea elektroniki, haholo-holo e loketseng bakeng sa topallo ea topallo
    Lintlha tsa sehlahisoa
    LBH
    Li-tag tsa lihlahisoa
    Paramente
    Mohlala No. RPS - UTP2
    Fretranosic freency 20Khz
    Tlhahiso e kholo 1000 Watt
    Mocheso oa mocheso 150 ~ 400 ° C
    Phepelo ea motlakase 220v / 50 - 60 hz
    Jenereithara ea ultrasonic Boholo 250 (w) x 310 (l) x 135 (h) limilimithara
    Boima 5 kg
    Tšobotsi Ultrasoc altranotic e atisang
    Mokhabiso oa por 20 * 15cm
    Fumana boleng ba theko ea theko Iso khalase, al, Mo, Cu joalo,


    1. Molao-motheo oa Core
    Tora ea Ultrasonic: Jenter ea Ultrasonic (hangata e na le maqhubu a metsi, a ho fetola matla a motlakase, a phahamisitsoeng - Liphoofolo tse Phahameng Micro -
    Kameho ea likhobi: Maqhubu a ultranonic a hlahisetsa li-bubble tse nyane ka lehetse a momahaneng 'me a ithorisa hang-hang, a roba setaele sa lesole ka holim'a lesole, le ho matlafatsa matla a maholo.
    Tinning pot.png
    2. Likarolo tsa mantlha
    Tin Bath: Mofuthu oa mocheso o phahameng (joalo ka ha Tianium Alloy (hangata sn - lead -

    Sistimi ea Ultrasonic:
    Trarharrr: e fetola matšoao a motlakase maemong a ho sisinyeha ha mmele.
    Amplifier: e kenyelletsa karohano ea vibration mme e e fetisetsa metsi a tin.
    Sistimi ea Heating: Heating Tube latigh kapa heater ea ceramic ho boloka lesole le qholotsang.
    Tsamaiso ea taolo: Module oa Lihlahisoa tsa PID tsa PID, ho ile ha fetola phetoho ea matla a motlakase, mosebetsi oa nako, mosebetsi oa nako, jj.

    3. Workflow
    3.1 Preheeaating: futhumatsa lesole ho mocheso o behiloeng (joalo ka 250 ° C).
    3.2 Ts'ebetso ea UltraSoc: Qala leqhubu la Ultrasonic, 'me bokaholimo ba mokelikeli o boima bo tla etsa seretse ka botlalo.
    3.3 Sesole: Ho qoqa le mosebetsi ho rekisoa (joalo ka boto ea PCB kapa tšepe e robehile, 'me ka potlako ea lla kapele.
    3.4 Ho phethela: Tsamaea le mosebetsi oa matsoho 'me u etse lesole le boreleli.


    4. Likarolo tsa teoni
    4.1 Ha ho na ho fepa metsi a hlokahalang: Maqhubu a ultrasonic a ka tlosa mokhethoa oa oxide, fokotsa masala a lik'hemik'hale le ho ba mosa -
    4.2 Ho sebetsa ho thata - ho - Ho - Etseha lisebelisoa: Ho thata joalo ka aluminium, tšepe e nang le spant, le cerations.
    4.3 Tsela e hlakileng: E ​​loketse ho phahama hape
    4,4 Ho hlophisoa ha mocheso: ho thothomela ha tin metsi ho qoba ho tšeha le ho fokotsa tšenyo e futhumatsang.


    5. Likopo tse tloaelehileng
    Tlhahiso ea elektroniki: Plug ea Boto ea Boto ea PCB - Ka Bophahami ba Mehala, FPC bo ile ba fetoha bohloa bo fetelletseng.
    Semiconductor liphutheloana tsa Semicondtor: Leseli la lipapali, Sensor Pina ea Sensor.
    Lisebelisoa tse khethehileng: Li-tab tsa betri tse khethehileng, li-tab tsa betri tsa lithium, li koahela litekete tsa tšepe.

  • E fetileng:
  • E 'ngoe:
  • Ultrasoc vibration
  • Tlohela molaetsa oa hau