I-20KHZ ye-ultrasonic tinning embizeni ye-aluminium / yethusi
| Model No. | RPS - UTP2 | |
| Imvamisa ye-ultrasonic | I-20KHZ | |
| Ukukhishwa okuphezulu | 1000 watt | |
| Ububanzi bokushisa | I-150 ~ 400 ° C | |
| Ukunikezwa kwamandla kagesi | 220V / 50 HZ | |
| Generator ye-ultrasonic | Ubungako | 250 (W) x 310 (L) x 135 (h) mm |
| Ubunzima | 5 kg | |
| Ubuso | I-Ultrasonic Amplitutude ikwaziswa | |
| Isici sembiza | 20 * 15cm | |
| Thola i-matrial yokuthengisa | I-ITO Ingilazi, Al, Mo, Cu njll. | |
1. Isimiso Esiyisisekelo
Ukudlidliza kwe-Ultrasonic
Umphumela we-Cavitation: Amagagasi e-Ultrasonic akhiqiza ama-bubble amancane ku-solder oncibilikisiwe bese ephula ungqimba lwe-oxide endaweni yensimbi, ethuthukisa ukungabuthisi komthengisi, nokwenza i-welding ibe namandla.

2. Izakhi eziphambili
I-Tin Bath: Isitsha esiphakeme sokumelana sensimbi sokumelana (njenge-titanium alloy) ebambele inyumbazane solder (imvamisa i-SN - ag -
Uhlelo lwe-Ultrasonic:
I-Transducer: Iguqula amasiginali kagesi abe yimishini yokudlidliza.
I-Amplifier: Khuthaza amandla okudlidliza futhi uwudlulisele ku-tin ketshezi.
Uhlelo lokushisa: ishubhu yokufudumeza kagesi noma i-heramic heater ukuze ulondoloze isimo esincibilikisiwe solder.
Uhlelo lokulawula: Imodyuli yokulawula amazinga e-PID, ukulungiswa kwamandla kwe-ultrasonic, umsebenzi wesikhathi, njll.
3. Ukuhamba komsebenzi
3.1 Ukuhamba phambili: Shisisa umthengisi ekushiseni okusethwe (njenge-250 ° C).
3.2 Ukusebenza kwe-Ultrasonic: Qala igagasi le-ultrasonic, kanti ingaphezulu likaketshezi lwe-tin luzodlidliza ngokulinganayo.
I-3.3 yokuthengisa: Gxila i-arkpiepe ukuthi ithengiswe (njenge-PCB Board noma i-terminal yensimbi) ku-tin tiquid, isendlalelo se-oxide siphukile, bese umthengisi ngokushesha wephuza indawo yokuthengisa.
3.4 Ukuqedwa: Thatha umsebenzi wokwenza futhi wakhe i-Smooth Order Joint.
4. Izici zobuchwepheshe
4.1 Akukho mkhuhlane odingekayo: Amagagasi e-Ultrasonic angasusa ungqimba we-oxide, anciphise izinsalela zamakhemikhali, futhi zinobungane bemvelo nezindleko - ukonga.
4.2 Kusebenza Kunzima - Ku- - I-Weld Materials: Inemiphumela ephakeme ngezinto ezisetshenziswayo ezinzima ukuwela ngokwesiko, njenge-aluminium, insimbi engagqwali, kanye nama-ceramics.
I-4.3 I-Welding Eqine: Ilungele ukuphakama - izimo ezifunwayo ezinjenge-micro - izingxenye zezimbotshana (ezinjengezimbotshana ze-SMT) kanye nemigqa yemvamisa.
4.4 Ukuqunjelwa kokushisa: Ukudlidliza okunamandla koketshezi lwe-tin kugwema ukushisa ngokweqile futhi kunciphise ukulimala okushisayo.
5. Izicelo ezijwayelekile
Ukukhiqiza nge-elekthronikhi: I-PCB Board Plug - Ku-Welding, FPC Flexible Circuible Welding.
Ukupakishwa kwe-semiconductor: Ifreyimu yokuhola, inzwa ye-Pin welding.
Izinto ezikhethekile: Amathebhu webhethri e-Lithium, i-Metal Shielting Cover Welding.














