Ultrasonic soldering and tinning

20kHz Ultrasonic tinning pot for Tinned Aluminum/Copper

20kHz Ultrasonic tinning pot for Tinned Aluminum/Copper

short description:

Ultrasonic Soldering Pot is a special equipment that uses high-frequency ultrasonic vibration to assist welding. It is mainly used for precision welding of electronic components, especially suitable for lead-free welding or materials with severe surface oxidation.
Product Detail
FAQ
Product Tags
Parameter
Model No. RPS-UTP2
Ultrasonic Frequency 20Khz
Maximum Output 1000 Watt
Temperature Range 150 ~ 400 °C
Power Supply 220V / 50-60 Hz
Ultrasonic Generator Size 250(W) x 310(L) x 135(H) mm
Weight 5 Kg
Feature Ultrasonic Amplitude Adjustable
Pot dimension 20*15cm
Avail Soldering Matrial ITO Glass, AL, Mo, Cu etc.,


1. Core Principle
Ultrasonic vibration: The ultrasonic generator (usually with a frequency of 20kHz-40kHz) converts electrical energy into mechanical vibration, which is transmitted to the solder liquid level in the tin pot through the transducer, generating high-frequency micro-amplitude fluctuations.
Cavitation effect: Ultrasonic waves generate tiny bubbles in the molten solder and burst them instantly, breaking the oxide layer on the metal surface, enhancing the wettability of the solder, and making the welding stronger.
Tinning pot.png
2. Main components
Tin bath: a high temperature resistant metal container (such as titanium alloy) that holds molten solder (usually Sn-Ag-Cu lead-free alloy) with controllable temperature (200°C-450°C).

Ultrasonic system:
Transducer: converts electrical signals into mechanical vibrations.
Amplifier: amplifies the vibration amplitude and transmits it to the tin liquid.
Heating system: electric heating tube or ceramic heater to maintain the molten state of solder.
Control system: PID temperature control module, ultrasonic power adjustment, timing function, etc.

3. Workflow
3.1 Preheating: Heat the solder to the set temperature (such as 250°C).
3.2 Ultrasonic activation: Start the ultrasonic wave, and the surface of the tin liquid will vibrate evenly.
3.3 Soldering: Immerse the workpiece to be soldered (such as PCB board or metal terminal) in the tin liquid, the oxide layer is broken, and the solder quickly wets the soldering surface.
3.4 Completion: Take out the workpiece and form a smooth solder joint.


4. Technical features
4.1 No flux required: Ultrasonic waves can remove the oxide layer, reduce chemical residues, and are environmentally friendly and cost-saving.
4.2 Applicable to difficult-to-weld materials: It has significant effects on materials that are difficult to weld traditionally, such as aluminum, stainless steel, and ceramics.
4.3 Precision welding: Suitable for high-demand scenarios such as micro-pitch components (such as SMT patches) and high-frequency signal lines.
4.4 Temperature uniformity: Dynamic vibration of tin liquid avoids local overheating and reduces thermal damage.


5. Typical applications
Electronic manufacturing: PCB board plug-in welding, FPC flexible circuit welding.
Semiconductor packaging: lead frame, sensor pin welding.
Special materials: lithium battery tabs, metal shielding cover welding.
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